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Laser for microprocessing

TRUMPF lasers work in the micrometer range and reliably maintain even the tightest tolerances. Short, powerful laser pulses vaporize the material directly, while the surrounding area remains virtually unaffected. Residues are minimal, so there is usually no need for cleaning or manual reworking. This precision enables micro-cutting, micro-welding, structuring and drilling - even with thin metals, foils, plastics, silicon, ceramics or glass. The finest components retain their shape, and surfaces remain flawless. Thanks to high processing speeds, our lasers are particularly suitable for microelectronics, precision mechanics, medical technology and semiconductor production.

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TruMicro Series 2000

Our precision artists in compact format - delicate microprocessing with maximum flexibility in the process parameters

Average power: 10 - 20 W
Wavelength: 515 nm, 1030 nm
Pulse duration: < 350 fs - 20 ps
Maximum pulse energy: 100 µJ at 1 MHz

The TruMicro Series 2000 is used for extremely thin layers and sensitive materials. Customizable pulse energy and frequencies open up a wide range of applications. The series cuts ultra-thin glass and foils, structures and marks metals - highly precisely and thermally gently with ultra-short pulses. The optional beam guidance via a hollow-core fiber makes machine integration particularly easy.

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TruMicro Series 6000

Our femtosecond powerhouse - for maximum throughput and high removal rates in series production

Average power: 30 - 300 W
Wavelength: 257 nm, 343 nm, 515 nm, 1030 nm
Pulse duration: < 500 fs, < 850 fs, 3 ps
Maximum pulse energy: 200 µJ at 1.5 MHz or 2 mJ at 150 kHz

The high average output of the TruMicro Series 6000 is ideal for series production in 24/7 operation. The laser is available in many variants with different wavelengths and pulse energies of up to 2 mJ and therefore covers a wide range of applications: From glass processing down to the millimeter range, engraving coated brake disks and cutting battery foils to display production with UV wavelengths.

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TruMicro Series 9000

Our pioneer - groundbreaking microprocessing of large surfaces with 1kW power

Average power: 1000 W
Wavelength: 1030 nm
Pulse duration: 1 ps
Maximum pulse energy: 10 mJ at 100 kHz

Ultrashort pulse processing is now also economical on large surfaces: The globally unique high laser power of the innovative TruMicro Series 9000 scales processes such as structuring, cleaning, ablation or cutting at high speed in the square meter range. And all this at a high impact rate - thanks to precise programming, several processing steps can be carried out flexibly with just one beam source.

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TruMicro Mark

Our ultrashort pulse all-rounder - for cold marking and microprocessing in the high-end branch

Average power: 10 - 20 W
Wavelength: 1030 nm
Pulse peak power: 22 MW
Component geometry: 2D+ and 3D

The TruMicro Mark enables ultra-precise marking, cutting and drilling without thermal effects. Ideal for black marking in medical technology, aerospace or jewelry production - with consistently high quality even on complex free form faces and sensitive materials.

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TruPulse nano

Our flexible nanosecond laser modules - for OEMs who value maximum versatility

20 - 600 W laser power
5 beam qualities from 1.3 - 5.0 M^M
Pulse duration: 3 ns - 2000 ns at up to 4 Mhz
Maximum pulse energy & -frequency: 0.8 - 6 mJ

The TruPulse nano portfolio offers a wide selection of power levels, beam qualities and pulse parameters - individually configurable depending on the application. A wide variety of materials can be precisely marked, cut, engraved or precision-welded using nanosecond pulses. Our TruPulse nano is aimed at integrators who flexibly combine modular components to create a customized solution.

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TruMark fiber laser

Our all-rounders - for marking and surface applications from medium to high performance

Average power: 20 - 200 W
Wavelength: ~ 1030 nm
Peak pulse power: 13 kW
Component geometry: 2D+

The TruMark fiber lasers bundle powerful laser sources for marking, structuring, cleaning, micro-cutting and micro-welding. Whether 2D codes, deep engraving, intricate structures or high-speed machining in series production - you will find the right product configuration for every application here.

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